Arrangement of sensor pads and display driver pads for input device

ABSTRACT

The disclosure generally describes input devices with associated processing system configured to perform display updating and capacitive sensing. The processing system includes first and second pluralities of display driver pads coupled with a plurality of source lines, and a plurality of sensor pads disposed between the first and second pluralities of display driver pads and coupled with a plurality of sensor electrodes through a plurality of conductive routing traces. The plurality of sensor electrodes includes at least one common electrode of a display device, the common electrode configured to be driven for display updating and capacitive sensing. The processing system is configured to drive the plurality of source lines for display updating, and to drive the plurality of sensor electrodes for capacitive sensing.

BACKGROUND

Field

Embodiments of the present disclosure generally relate to electronicdevices.

Description of the Related Art

Input devices including proximity sensor devices (also commonly calledtouchpads or touch sensor devices) are widely used in a variety ofelectronic systems. A proximity sensor device typically includes asensing region, often demarked by a surface, in which the proximitysensor device determines the presence, location, and/or motion of one ormore input objects. Proximity sensor devices may be used to provideinterfaces for the electronic system. For example, proximity sensordevices are often used as input devices for larger computing systems(such as opaque touchpads integrated in, or peripheral to, notebook ordesktop computers). Proximity sensor devices are also often used insmaller computing systems (such as touch screens integrated in cellularphones).

BRIEF SUMMARY

One embodiment described herein includes an input device comprising aplurality of sensor electrodes, wherein each sensor electrode of theplurality of sensor electrodes comprises at least one common electrodeof a plurality of common electrodes of a display device, the commonelectrodes configured to be driven for display updating and capacitivesensing. The input device further comprises a plurality of source linesand a processing system. The processing system comprises a displaydriver module comprising a first plurality of display driver pads and asecond plurality of display driver pads, wherein each of the first andsecond plurality of display driver pads are coupled to at least onesource line of the plurality of source lines, the display driver moduleconfigured to drive the plurality of source lines for display updating.The processing system further comprises a sensor module comprising aplurality of sensor pads coupled to the plurality of sensor electrodes,the sensor module configured to drive the plurality of sensor electrodesfor capacitive sensing, wherein the plurality of sensor pads is disposedbetween the first plurality of pads and the second plurality of pads.

Another embodiment described herein includes a processing systemcomprising a display driver module comprising a first plurality ofdisplay driver pads and a second plurality of display driver pads,wherein each of the first and second plurality of display driver padsare coupled to at least one source line of a plurality source lines, thedisplay driver module configured to drive the plurality of source linesfor display updating. The processing system further comprises a sensormodule comprising a plurality of sensor pads coupled to a plurality ofsensor electrodes, wherein each sensor electrode of the plurality ofsensor electrodes comprises at least one common electrode of a pluralityof common electrodes of a display device, the common electrodesconfigured to be driven for display updating and capacitive sensing, thesensor module configured to drive the plurality of sensor electrodes forcapacitive sensing, wherein the plurality of sensor pads is disposedbetween the first plurality of pads and the second plurality of pads.

Another embodiment described herein includes an input device comprisinga plurality of sensor electrodes, wherein each sensor electrode of theplurality of sensor electrodes comprises at least one common electrodeof a plurality of common electrodes of a display device, the commonelectrodes configured to be driven for display updating and capacitivesensing. The input device further comprises a plurality of conductiverouting traces, each conductive routing trace coupled to a respectiveone of the plurality of sensor electrodes, and a plurality of sourcelines, wherein a first conductive routing trace of the plurality ofrouting traces and a first source line of the plurality of source linesoverlap each other. The input device further comprises a processingsystem comprising a first plurality of display driver pads and a secondplurality of display driver pads, wherein each of the first and secondplurality of display driver pads are coupled to at least one source lineof the plurality source lines. The processing system further comprises aplurality of sensor pads, where each sensor pad of the plurality ofsensor pads is coupled to a respective one of the plurality ofconductive routing traces, wherein the plurality of sensor pads isdisposed between the first plurality of pads and the second plurality ofpads, and wherein the processing system is configured to drive theplurality of source lines for display updating, and to drive theplurality of sensor electrodes for capacitive sensing via the conductiverouting traces.

BRIEF DESCRIPTION OF DRAWINGS

So that the manner in which the above recited features of the presentinvention can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this disclosure and are therefore not to beconsidered limiting of its scope, for the disclosure may admit to otherequally effective embodiments.

FIG. 1 is a schematic block diagram of an exemplary input device,according to one embodiment.

FIG. 2 illustrates a simplified exemplary array of sensor elements thatmay be used in an input device, according to one embodiment.

FIG. 3 illustrates a display panel including an integrated input devicehaving a pattern of capacitive sensing elements, according to oneembodiment.

FIG. 4 illustrates an exemplary arrangement of vias in a regularpattern, according to one embodiment.

FIG. 5 illustrates interleaved groups of pads within an exemplaryprocessing system, according to one embodiment.

FIG. 6 illustrates an exemplary arrangement of vias in a regular patternaccording to the interleaved groups of pads illustrated in FIG. 5,according to one embodiment.

FIGS. 7 and 8 each illustrate an exemplary arrangement of vias in aregular pattern and supporting sensing on multiple adjacent rows ofsensor electrodes, according to one embodiment.

FIG. 9 illustrates an exemplary arrangement of vias in a regular patternand supporting sensing with one or more grid electrodes, according toone embodiment.

FIG. 10 illustrates an implementation of a processing system includingmultiple portions of a display driver module, according to oneembodiment.

FIG. 11 illustrates techniques for selectively connecting a plurality ofrouting traces with an arrangement of vias in a regular pattern,according to one embodiment.

FIG. 12 is a functional diagram of an exemplary arrangement of vias in aregular pattern relative to an array of sensor elements including gridelectrodes, according to one embodiment.

FIG. 13 illustrates an exemplary configuration of a plurality of routingtraces to implement the arrangement of vias depicted in FIG. 12,according to one embodiment.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements disclosed in oneembodiment may be beneficially utilized on other embodiments withoutspecific recitation. The drawings referred to here should not beunderstood as being drawn to scale unless specifically noted. Also, thedrawings are often simplified and details or components omitted forclarity of presentation and explanation. The drawings and discussionserve to explain principles discussed below, where like designationsdenote like elements.

DETAILED DESCRIPTION

The following detailed description is merely exemplary in nature and isnot intended to limit the disclosure or its application and uses.Furthermore, there is no intention to be bound by any expressed orimplied theory presented in the preceding technical field, background,brief summary or the following detailed description.

Various embodiments of the present disclosure relate to an input devicecomprising a plurality of vias disposed in a regular pattern. Theplurality of vias are used to connect a plurality of sensor electrodesdisposed in a first layer with a plurality of routing traces disposed ina second layer. In turn, the sensor electrodes and routing traces areconfigured to couple with a processing system that performs inputsensing. The regular pattern of the plurality of vias corresponds to anareal extent of a sensing region defined proximate to the sensorelectrodes. Some embodiments may further include dummy vias included inthe regular pattern of the plurality of vias.

Disposing the plurality of vias in a regular pattern permits a simplerprocess of visual inspection during production, as a camera or othervisual sensing device may have a reduced number of changes toorientation, position, etc. to detect all of the vias. In some cases,the regular pattern of vias increases the uniformity of the inputdevice, which can increase the reliability of its operation. In somecases the regular pattern of vias can reduce the number of lines ortraces formed or otherwise included in the input device. In these cases,the traces can be cut or otherwise segmented to provide desired viaconnections with the sensor electrodes. Such a feature permits the inputdevice to be customized for use with a particular processing system. Forexample, multiplexing capabilities of different processing systems mayvary, so that the traces of the input device may be cut differently inorder to connect with the target processing system. The desiredconnections may be made between the processing system and certain sensorelectrodes by cutting or segmenting the traces.

FIG. 1 is a schematic block diagram of an input device 100 in accordancewith embodiments of the present technology. In one embodiment, inputdevice 100 comprises a display device comprising an integrated sensingdevice. Although the illustrated embodiments of the present disclosureare shown integrated with a display device, it is contemplated that theinvention may be embodied in the input devices that are not integratedwith display devices. The input device 100 may be configured to provideinput to an electronic system 150. As used in this document, the term“electronic system” (or “electronic device”) broadly refers to anysystem capable of electronically processing information. Somenon-limiting examples of electronic systems include personal computersof all sizes and shapes, such as desktop computers, laptop computers,netbook computers, tablets, web browsers, e-book readers, and personaldigital assistants (PDAs). Additional example electronic systems includecomposite input devices, such as physical keyboards that include inputdevice 100 and separate joysticks or key switches. Further exampleelectronic systems include peripherals such as data input devices(including remote controls and mice), and data output devices (includingdisplay screens and printers). Other examples include remote terminals,kiosks, and video game machines (e.g., video game consoles, portablegaming devices, and the like). Other examples include communicationdevices (including cellular phones, such as smart phones), and mediadevices (including recorders, editors, and players such as televisions,set-top boxes, music players, digital photo frames, and digitalcameras). Additionally, the electronic system could be a host or a slaveto the input device.

The input device 100 can be implemented as a physical part of theelectronic system, or can be physically separate from the electronicsystem. As appropriate, the input device 100 may communicate with partsof the electronic system using any one or more of the following: buses,networks, and other wired or wireless interconnections. Examples includeI²C, SPI, PS/2, Universal Serial Bus (USB), Bluetooth, RF, and IRDA.

In FIG. 1, the input device 100 is shown as a proximity sensor device(also often referred to as a “touchpad” or a “touch sensor device”)configured to sense input provided by one or more input objects 140 in asensing region 170. Example input objects include fingers and styli, asshown in FIG. 1.

Sensing region 170 encompasses any space above, around, in and/or nearthe input device 100 in which the input device 100 is able to detectuser input (e.g., user input provided by one or more input objects 140).The sizes, shapes, and locations of particular sensing regions may varywidely from embodiment to embodiment. In some embodiments, the sensingregion 170 extends from a surface of the input device 100 in one or moredirections into space until signal-to-noise ratios prevent sufficientlyaccurate object detection. The distance to which this sensing region 170extends in a particular direction, in various embodiments, may be on theorder of less than a millimeter, millimeters, centimeters, or more, andmay vary significantly with the type of sensing technology used and theaccuracy desired. Thus, some embodiments sense input that comprises nocontact with any surfaces of the input device 100, contact with an inputsurface (e.g., a touch surface) of the input device 100, contact with aninput surface of the input device 100 coupled with some amount ofapplied force or pressure, and/or a combination thereof. In variousembodiments, input surfaces may be provided by surfaces of casingswithin which the sensor electrodes reside, by face sheets applied overthe sensor electrodes or any casings, etc. In some embodiments, thesensing region 170 has a rectangular shape when projected onto an inputsurface of the input device 100.

The input device 100 may utilize any combination of sensor componentsand sensing technologies to detect user input in the sensing region 170.The input device 100 comprises a plurality of sensing elements 124 fordetecting user input. The sensing elements 124 include a plurality ofsensor electrodes 120 and one or more grid electrodes 122. As severalnon-limiting examples of sensing technologies, the input device 100 mayuse capacitive, elastive, resistive, inductive, magnetic acoustic,ultrasonic, and/or optical techniques.

Some implementations are configured to provide images that span one,two, three, or higher dimensional spaces. Some implementations areconfigured to provide projections of input along particular axes orplanes.

In some resistive implementations of the input device 100, a flexibleand conductive first layer is separated by one or more spacer elementsfrom a conductive second layer. During operation, one or more voltagegradients are created across the layers. Pressing the flexible firstlayer may deflect it sufficiently to create electrical contact betweenthe layers, resulting in voltage outputs reflective of the point(s) ofcontact between the layers. These voltage outputs may be used todetermine positional information.

In some inductive implementations of the input device 100, one or moresensing elements 124 detect loop currents induced by a resonating coilor pair of coils. Some combination of the magnitude, phase, andfrequency of the currents may then be used to determine positionalinformation.

In some capacitive implementations of the input device 100, voltage orcurrent is applied to create an electric field. Nearby input objectscause changes in the electric field, and produce detectable changes incapacitive coupling that may be detected as changes in voltage, current,or the like.

Some capacitive implementations utilize arrays or other regular orirregular patterns of capacitive sensing elements 124 to create electricfields. In some capacitive implementations, separate sensing elements124 may be ohmically shorted together to form larger sensor electrodes.Some capacitive implementations utilize resistive sheets, which may beuniformly resistive.

As discussed above, some capacitive implementations utilize “selfcapacitance” (or “absolute capacitance”) sensing methods based onchanges in the capacitive coupling between sensor electrodes 120 and aninput object. In various embodiments, an input object near the sensorelectrodes 120 alters the electric field near the sensor electrodes 120,thus changing the measured capacitive coupling. In one implementation,an absolute capacitance sensing method operates by modulating sensorelectrodes 120 with respect to a reference voltage (e.g. system ground),and by detecting the capacitive coupling between the sensor electrodes120 and input objects 140.

Additionally as discussed above, some capacitive implementations utilize“mutual capacitance” (or “transcapacitance”) sensing methods based onchanges in the capacitive coupling between sensor electrodes 120. Invarious embodiments, an input object 140 near the sensor electrodes 120alters the electric field between the sensor electrodes 120, thuschanging the measured capacitive coupling. In one implementation, atranscapacitive sensing method operates by detecting the capacitivecoupling between one or more transmitter sensor electrodes (also“transmitter electrodes”) and one or more receiver sensor electrodes(also “receiver electrodes”) as further described below. Transmittersensor electrodes may be modulated relative to a reference voltage(e.g., system ground) to transmit a transmitter signals. Receiver sensorelectrodes may be held substantially constant relative to the referencevoltage to facilitate receipt of resulting signals. A resulting signalmay comprise effect(s) corresponding to one or more transmitter signals,and/or to one or more sources of environmental interference (e.g. otherelectromagnetic signals). Sensor electrodes 120 may be dedicatedtransmitter electrodes or receiver electrodes, or may be configured toboth transmit and receive.

In FIG. 1, the processing system 110 is shown as part of the inputdevice 100. The processing system 110 is configured to operate thehardware of the input device 100 to detect input in the sensing region170. The processing system 110 comprises parts of or all of one or moreintegrated circuits (ICs) and/or other circuitry components. Forexample, a processing system for a mutual capacitance sensor device maycomprise transmitter circuitry configured to transmit signals withtransmitter sensor electrodes, and/or receiver circuitry configured toreceive signals with receiver sensor electrodes. In some embodiments,the processing system 110 also comprises electronically-readableinstructions, such as firmware code, software code, and/or the like. Insome embodiments, components composing the processing system 110 arelocated together, such as near sensing element(s) 124 of the inputdevice 100. In other embodiments, components of processing system 110are physically separate with one or more components close to sensingelement(s) 124 of input device 100, and one or more componentselsewhere. For example, the input device 100 may be a peripheral coupledto a desktop computer, and the processing system 110 may comprisesoftware configured to run on a central processing unit of the desktopcomputer and one or more ICs (perhaps with associated firmware) separatefrom the central processing unit. As another example, the input device100 may be physically integrated in a phone, and the processing system110 may comprise circuits and firmware that are part of a main processorof the phone. In some embodiments, the processing system 110 isdedicated to implementing the input device 100. In other embodiments,the processing system 110 also performs other functions, such asoperating display screens, driving haptic actuators, etc.

The processing system 110 may be implemented as a set of modules thathandle different functions of the processing system 110. Each module maycomprise circuitry that is a part of the processing system 110,firmware, software, or a combination thereof. In various embodiments,different combinations of modules may be used. Example modules includehardware operation modules for operating hardware such as sensorelectrodes and display screens, data processing modules for processingdata such as sensor signals and positional information, and reportingmodules for reporting information. Further example modules includesensor operation modules configured to operate sensing element(s) 124 todetect input, identification modules configured to identify gesturessuch as mode changing gestures, and mode changing modules for changingoperation modes.

In some embodiments, the processing system 110 responds to user input(or lack of user input) in the sensing region 170 directly by causingone or more actions. Example actions include changing operation modes,as well as GUI actions such as cursor movement, selection, menunavigation, and other functions. In some embodiments, the processingsystem 110 provides information about the input (or lack of input) tosome part of the electronic system (e.g. to a central processing systemof the electronic system that is separate from the processing system110, if such a separate central processing system exists). In someembodiments, some part of the electronic system processes informationreceived from the processing system 110 to act on user input, such as tofacilitate a full range of actions, including mode changing actions andGUI actions.

For example, in some embodiments, the processing system 110 operates thesensing element(s) 124 of the input device 100 to produce electricalsignals indicative of input (or lack of input) in the sensing region170. The processing system 110 may perform any appropriate amount ofprocessing on the electrical signals in producing the informationprovided to the electronic system. For example, the processing system110 may digitize analog electrical signals obtained from the sensingelements 124. As another example, the processing system 110 may performfiltering, demodulation or other signal conditioning. In variousembodiments processing system 110 generates a capacitive image directlyfrom the resulting signals received with sensing elements 124 (sensorelectrodes 120). In other embodiments, processing system 110 spatiallyfilters (e.g., taking a difference, weighted sum of neighboringelements) the resulting signals received with sensing elements 124 (orsensor electrodes 120) to generate a sharpened or averaged image. As yetanother example, the processing system 110 may subtract or otherwiseaccount for a baseline, such that the information reflects a differencebetween the electrical signals and the baseline. As yet furtherexamples, the processing system 110 may determine positionalinformation, recognize inputs as commands, recognize handwriting, andthe like.

“Positional information” as used herein broadly encompasses absoluteposition, relative position, velocity, acceleration, and other types ofspatial information. Exemplary “zero-dimensional” positional informationincludes near/far or contact/no contact information. Exemplary“one-dimensional” positional information includes positions along anaxis. Exemplary “two-dimensional” positional information includesmotions in a plane. Exemplary “three-dimensional” positional informationincludes instantaneous or average velocities in space. Further examplesinclude other representations of spatial information. Historical dataregarding one or more types of positional information may also bedetermined and/or stored, including, for example, historical data thattracks position, motion, or instantaneous velocity over time.

In some embodiments, the input device 100 is implemented with additionalinput components that are operated by the processing system 110 or bysome other processing system. These additional input components mayprovide redundant functionality for input in the sensing region 170, orsome other functionality. FIG. 1 shows buttons 130 near the sensingregion 170 that can be used to facilitate selection of items using theinput device 100. Other types of additional input components includesliders, balls, wheels, switches, and the like. Conversely, in someembodiments, the input device 100 may be implemented with no other inputcomponents.

In some embodiments, the input device 100 comprises a touch screeninterface, and the sensing region 170 overlaps at least part of anactive area of a display screen of the display device 160. For example,the input device 100 may comprise substantially transparent sensingelements 124 overlaying the display screen and provide a touch screeninterface for the associated electronic system. The display screen maybe any type of dynamic display capable of displaying a visual interfaceto a user, and may include any type of light emitting diode (LED),organic LED (OLED), cathode ray tube (CRT), liquid crystal display(LCD), plasma, electroluminescence (EL), or other display technology.The input device 100 and the display device 160 may share physicalelements. For example, some embodiments may utilize some of the sameelectrical components for displaying and sensing (e.g., the activematrix control electrodes configured to control the source, gate, and/orVcom voltages). Shared components may include display electrodes,substrates, connectors, and/or connections. As another example, thedisplay device 160 may be operated in part or in total by the processingsystem 110.

It should be understood that while many embodiments of the presenttechnology are described in the context of a fully functioningapparatus, the mechanisms of the present technology are capable of beingdistributed as a program product (e.g., software) in a variety of forms.For example, the mechanisms of the present technology may be implementedand distributed as a software program on information bearing media thatare readable by electronic processors (e.g., non-transitorycomputer-readable and/or recordable/writable information bearing mediareadable by the processing system 110). Additionally, the embodiments ofthe present technology apply equally regardless of the particular typeof medium used to carry out the distribution. Examples ofnon-transitory, electronically readable media include various discs,memory sticks, memory cards, memory modules, and the like.Electronically readable media may be based on flash, optical, magnetic,holographic, or any other suitable storage technology.

FIG. 2 shows a portion of an exemplary pattern of sensing elements 124configured to sense in the sensing region 170 associated with thepattern, according to some embodiments. For clarity of illustration anddescription, FIG. 2 shows the sensor electrodes 120 of the sensingelements 124 in a pattern of simple rectangles with the grid electrode222 disposed therebetween, and does not show various other components.The exemplary pattern of sensing elements 124 comprises an array ofsensor electrodes 120 _(X,Y) (referred collectively as sensor electrodes120) arranged in X columns and Y rows, wherein X and Y are positiveintegers, although one of X and Y may be zero. It is contemplated thatthe pattern of sensing elements 124 may comprises a plurality of sensorelectrodes 120 having other configurations, such as polar arrays,repeating patters, non-repeating patterns, a single row or column, orother suitable arrangement. Further, in various embodiments the numberof sensor electrodes may vary from row to row and/or column to column.In one embodiment, at least one row and/or column of sensor electrodes120 is offset from the others, such it extends further in at least onedirection than the others. The sensor electrodes 120 and grid electrodes122 are coupled to the processing system 110 and utilized to determinethe presence (or lack thereof) of an input object 140 in the sensingregion 170.

In a first mode of operation, the arrangement of sensor electrodes 120(120 ₁₋₁, 120 ₂₋₁, 120 ₃₋₁, . . . , 120 _(X,Y)) may be utilized todetect the presence of an input object via absolute sensing techniques.That is, processing system 110 is configured to modulate sensorelectrodes 120 to acquire measurements of changes in capacitive couplingbetween the modulated sensor electrodes 120 and an input object todetermine the position of the input object. Processing system 110 isfurther configured to determine changes of absolute capacitance based ona measurement of resulting signals received with sensor electrodes 120which are modulated.

The sensor electrodes 120 are typically ohmically isolated from eachother, and also ohmically isolated from the grid electrode 122. That is,one or more insulators separate the sensor electrodes 120 (and gridelectrode 122) and prevent them from electrically shorting to eachother. In some embodiments, the sensor electrodes 120 and grid electrode122 are separated by insulative gap 202. The insulative gap 202separating the sensor electrodes 120 and grid electrode 122 may befilled with an electrically insulating material, or may be an air gap.In some embodiments, the sensor electrodes 120 and the grid electrode122 are vertically separated by one or more layers of insulativematerial. In some other embodiments, the sensor electrodes 120 and thegrid electrode 122 are separated by one or more substrates; for example,they may be disposed on opposite sides of the same substrate, or ondifferent substrates. In yet other embodiments, the grid electrode 122may be composed of multiple layers on the same substrate, or ondifferent substrates. In one embodiment, a first grid electrode may beformed on a first substrate or first side of a substrate and a secondgrid electrode may be formed on a second substrate or a second side of asubstrate. For example, a first grid comprises one or more commonelectrodes disposed on a TFT layer of the display device 160 and asecond grid electrode is disposed on the color filter glass of thedisplay device 160. In one embodiment, the dimensions of the first gridelectrode are equal to the dimensions of the second grid electrode. Inone embodiment, at least one dimension of the first grid electrodediffers from a dimension of the second grid electrode. For example, thefirst grid electrode may be configured such that it is disposed betweena first and second sensor electrode 120 and the second grid electrodemay be configured such that it overlaps at least one of the first andsecond sensor electrodes 120 and the first grid electrode. Further, thefirst grid electrode may be configured such that it is disposed betweena first and second sensor electrode 120 and the second grid electrodemay be configured such that it only overlaps the first grid electrodeand is smaller than the first grid electrode.

In a second mode of operation, the sensor electrodes 120 (120 ₁₋₁, 120₂₋₁, 120 ₃₋₁, . . . , 120 _(X,Y)) may be utilized to detect the presenceof an input object via transcapacitive sensing techniques when atransmitter signal is driven onto the grid electrode 122. That is,processing system 110 is configured to drive the grid electrode 122 witha transmitter signal and to receive resulting signals with each sensorelectrode 120, where a resulting signal comprising effects correspondingto the transmitter signal, which is utilized by the processing system110 or other processor to determine the position of the input object.

In a third mode of operation, the sensor electrodes 120 may be splitinto groups of transmitter and receiver electrodes utilized to detectthe presence of an input object via transcapacitive sensing techniques.That is, processing system 110 may drive a first group of sensorelectrodes 120 with a transmitter signal and receive resulting signalswith the second group of sensor electrodes 120, where a resulting signalcomprising effects corresponding to the transmitter signal. Theresulting signal is utilized by the processing system 110 or otherprocessor to determine the position of the input object.

The input device 100 may be configured to operate in any one of themodes described above. The input device 100 may also be configured toswitch between any two or more of the modes described above.

The areas of localized capacitive sensing of capacitive couplings may betermed “capacitive pixels,” “touch pixels,” “tixels,” etc. Capacitivepixels may be formed between an individual sensor electrode 120 and areference voltage in the first mode of operation, between the sensorelectrodes 120 and grid electrode 122 in the second mode of operation,and between groups of sensor electrodes 120 used as transmitter andreceiver electrodes. The capacitive coupling changes with the proximityand motion of input objects 140 in the sensing region 170 associatedwith the sensing elements 124, and thus may be used as an indicator ofthe presence of the input object in the sensing region of the inputdevice 100.

In some embodiments, the sensor electrodes 120 are “scanned” todetermine these capacitive couplings. That is, in one embodiment, one ormore of the sensor electrodes 120 are driven to transmit transmittersignals. Transmitters may be operated such that one transmitterelectrode transmits at one time, or such that multiple transmitterelectrodes transmit at the same time. Where multiple transmitterelectrodes transmit simultaneously, the multiple transmitter electrodesmay transmit the same transmitter signal and thereby produce aneffectively larger transmitter electrode. Alternatively, the multipletransmitter electrodes may transmit different transmitter signals. Forexample, multiple transmitter electrodes may transmit differenttransmitter signals according to one or more coding schemes that enabletheir combined effects on the resulting signals of receiver electrodesto be independently determined. In one embodiment, multiple transmitterelectrodes may simultaneously transmit the same transmitter signal whilethe receiver electrodes are received with using a scanning scheme.

The sensor electrodes 120 configured as receiver sensor electrodes maybe operated singly or multiply to acquire resulting signals. Theresulting signals may be used to determine measurements of thecapacitive couplings at the capacitive pixels. Processing system 110 maybe configured to receive with the sensor electrodes 120 in a scanningfashion and/or a multiplexed fashion to reduce the number ofsimultaneous measurements to be made, as well as the size of thesupporting electrical structures. In one embodiment, one or more sensorelectrodes are coupled to a receiver of processing system 110 via aswitching element such as a multiplexer or the like. In such anembodiment, the switching element may be internal to processing system110 or external to processing system 110. In one or more embodiments,the switching elements may be further configured to couple a sensorelectrode with a transmitter or other signal and/or voltage potential.In one embodiment, the switching element may be configured to couplemore than one receiver electrode to a common receiver at the same time.

In other embodiments, “scanning” sensor electrodes 120 to determinethese capacitive couplings comprises modulating one or more of thesensor electrodes and measuring an absolute capacitance of the one orsensor electrodes. In another embodiment, the sensor electrodes may beoperated such that more than one sensor electrode is driven and receivedwith at a time. In such embodiments, an absolute capacitive measurementmay be obtained from each of the one or more sensor electrodes 120simultaneously. In one embodiment, each of the sensor electrodes 120 aresimultaneously driven and received with, obtaining an absolutecapacitive measurement simultaneously from each of the sensor electrodes120. In various embodiments, processing system 110 may be configured toselectively modulate a portion of sensor electrodes 120. For example,the sensor electrodes may be selected based on, but not limited to, anapplication running on the host processor, a status of the input device,and an operating mode of the sensing device. In various embodiments,processing system 110 may be configured to selectively shield at least aportion of sensor electrodes 120 and to selectively shield or transmitwith the grid electrode(s) 122 while selectively receiving and/ortransmitting with other sensor electrodes 120.

A set of measurements from the capacitive pixels form a “capacitiveimage” (also “capacitive frame”) representative of the capacitivecouplings at the pixels. Multiple capacitive images may be acquired overmultiple time periods, and differences between them used to deriveinformation about input in the sensing region. For example, successivecapacitive images acquired over successive periods of time can be usedto track the motion(s) of one or more input objects entering, exiting,and within the sensing region.

In any of the above embodiments, multiple sensor electrodes 120 may beganged together such that the sensor electrodes 120 are simultaneouslymodulated or simultaneously received with. As compared to the methodsdescribed above, ganging together multiple sensor electrodes may producea coarse capacitive image that may not be usable to discern precisepositional information. However, a coarse capacitive image may be usedto sense presence of an input object. In one embodiment, the coarsecapacitive image may be used to move processing system 110 or the inputdevice 100 out of a “doze” mode or low-power mode. In one embodiment,the coarse capacitive image may be used to move a capacitive sensing ICout of a “doze” mode or low-power mode. In another embodiment, thecoarse capacitive image may be used to move a host IC out of a “doze”mode or low-power mode. The coarse capacitive image may correspond tothe entire sensor area or only to a portion of the sensor area.

The background capacitance of the input device 100 is the capacitiveimage associated with no input object in the sensing region 170. Thebackground capacitance changes with the environment and operatingconditions, and may be estimated in various ways. For example, someembodiments take “baseline images” when no input object is determined tobe in the sensing region 170, and use those baseline images as estimatesof their background capacitances. The background capacitance or thebaseline capacitance may be present due to stray capacitive couplingbetween two sensor electrodes, where one sensor electrode is driven witha modulated signal and the other is held stationary relative to systemground, or due to stray capacitive coupling between a receiver electrodeand nearby modulated electrodes. In many embodiments, the background orbaseline capacitance may be relatively stationary over the time periodof a user input gesture.

Capacitive images can be adjusted for the background capacitance of theinput device 100 for more efficient processing. Some embodimentsaccomplish this by “baselining” measurements of the capacitive couplingsat the capacitive pixels to produce a “baselined capacitive image.” Thatis, some embodiments compare the measurements forming a capacitanceimage with appropriate “baseline values” of a “baseline image”associated with those pixels, and determine changes from that baselineimage.

In some touch screen embodiments, one or more of the sensor electrodes120 comprise one or more display electrodes used in updating the displayof the display screen. The display electrodes may comprise one or moreelements of the active matrix display such as one or more segments of asegmented Vcom electrode (common electrode(s)), a source drive line,gate line, an anode sub-pixel electrode or cathode pixel electrode, orany other display element. These display electrodes may be disposed onan appropriate display screen substrate. For example, the commonelectrodes may be disposed on the a transparent substrate (a glasssubstrate, TFT glass, or any other transparent material) in some displayscreens (e.g., In-Plane Switching (IPS), Fringe Field Switching (FFS) orPlane to Line Switching (PLS) Organic Light Emitting Diode (OLED)), onthe bottom of the color filter glass of some display screens (e.g.,Patterned Vertical Alignment (PVA) or Multi-domain Vertical Alignment(MVA)), over an emissive layer (OLED), etc. In such embodiments, thedisplay electrode can also be referred to as a “combination electrode,”since it performs multiple functions. In various embodiments, each ofthe sensor electrodes 120 comprises one or more common electrodes. Inother embodiments, at least two sensor electrodes 120 may share at leastone common electrode. While the following description may describe thatsensor electrodes 120 and/or grid electrode 122 comprise one or morecommon electrodes, various other display electrodes as describe abovemay also be used in conjunction with the common electrode or as analternative to the common electrodes. In various embodiments, the sensorelectrodes 120 and grid electrode 122 comprise the entire commonelectrode layer (Vcom electrode).

In various touch screen embodiments, the “capacitive frame rate” (therate at which successive capacitive images are acquired) may be the sameor be different from that of the “display frame rate” (the rate at whichthe display image is updated, including refreshing the screen toredisplay the same image). In various embodiments, the capacitive framerate is an integer multiple of the display frame rate. In otherembodiments, the capacitive frame rate is a fractional multiple of thedisplay frame rate. In yet further embodiments, the capacitive framerate may be any fraction or integer of the display frame rate. In one ormore embodiments, the display frame rate may change (e.g., to reducepower or to provide additional image data such as a 3D displayinformation) while touch frame rate maintains constant. In otherembodiment, the display frame rate may remain constant while the touchframe rate is increased or decreased.

Continuing to refer to FIG. 2, the processing system 110 coupled to thesensor electrodes 120 includes a sensor module 204 and optionally, adisplay driver module 208. The sensor module 204 includes circuitryconfigured to drive at least one of the sensor electrodes 120 forcapacitive sensing during periods in which input sensing is desired. Inone embodiment, the sensor module 204 is configured to drive a modulatedsignal onto the at least one sensor electrode to detect changes inabsolute capacitance between the at least one sensor electrode and aninput object. In another embodiment, the sensor module 204 is configuredto drive a transmitter signal onto the at least one sensor electrode todetect changes in a transcapacitance between the at least one sensorelectrode and another sensor electrode. The modulated and transmittersignals are generally varying voltage signals comprising a plurality ofvoltage transitions over a period of time allocated for input sensing.In various embodiments, the sensor electrodes 120 and/or grid electrode122 may be driven differently in different modes of operation. In oneembodiment, the sensor electrodes 120 and/or grid electrode 122 may bedriven with signals (modulated signals, transmitter signals and/orshield signals) that may differ in any one of phase, amplitude, and/orshape. In various embodiments, the modulated signal and transmittersignal are similar in at least one shape, frequency, amplitude, and/orphase. In other embodiments, the modulated signal and the transmittersignals are different in frequency, shape, phase, amplitude, and phase.The sensor module 204 may be selectively coupled one or more of thesensor electrodes 120 and/or the grid electrode 122. For example, thesensor module 204 may be coupled selected portions of the sensorelectrodes 120 and operate in either an absolute or transcapacitivesensing mode. In another example, the sensor module 204 may be adifferent portion of the sensor electrodes 120 and operate in either anabsolute or transcapacitive sensing mode. In yet another example, thesensor module 204 may be coupled to all the sensor electrodes 120 andoperate in either an absolute or transcapacitive sensing mode.

The sensor module 204 is configured to operate the grid electrode 122 asa shield electrode that may shield sensor electrodes 120 from theelectrical effects of nearby conductors. In one embodiment, theprocessing system is configured to operate the grid electrode 122 as ashield electrode that may shield sensor electrodes 120 from theelectrical effects of nearby conductors, and to guard the sensorelectrodes 120 from grid electrode 122, at least partially reducing theparasitic capacitance between the grid electrode 122 and the sensorelectrodes 120. In one embodiment, a shielding signal is driven onto thegrid electrode 122. The shielding signal may be a ground signal, such asthe system ground or other ground, or any other constant voltage (i.e.,non-modulated) signal. In another embodiment, operating the gridelectrode 122 as a shield electrode may comprise electrically floatingthe grid electrode. In embodiment, grid electrode 122 is able to operateas an effective shield electrode while being electrode floated due toits large coupling to the other sensor electrodes. In other embodiment,the shielding signal may be referred to as a guarding signal where theguarding signal is a varying voltage signal having at least one of asimilar phase, frequency and amplitude as the modulated signal driven onto the sensor electrodes. In one or more embodiment, routing traces(e.g., routing traces 240 and/or 242) may be shielded from responding toan input object due to routing beneath the grid electrode 122 and/orsensor electrodes 120, and therefore may not be part of the activesensor electrodes, shown as sensor electrodes 120.

In one or more embodiments, capacitive sensing (or input sensing) anddisplay updating may occur during at least partially overlappingperiods. For example, as a common electrode is driven for displayupdating, the common electrode may also be driven for capacitivesensing. In another embodiment, capacitive sensing and display updatingmay occur during non-overlapping periods, also referred to asnon-display update periods. In various embodiments, the non-displayupdate periods may occur between display line update periods for twodisplay lines of a display frame and may be at least as long in time asthe display update period. In such embodiments, the non-display updateperiod may be referred to as a long horizontal blanking period, longh-blanking period or a distributed blanking period, where the blankingperiod occurs between two display updating periods and is at least aslong as a display update period. In one embodiment, the non-displayupdate period occurs between display line update periods of a frame andis long enough to allow for multiple transitions of the transmittersignal to be driven onto the sensor electrodes 120. In otherembodiments, the non-display update period may comprise horizontalblanking periods and vertical blanking periods. Processing system 110may be configured to drive sensor electrodes 120 for capacitive sensingduring any one or more of or any combination of the differentnon-display update times. Synchronization signals may be shared betweensensor module 204 and display module 208 to provide accurate control ofoverlapping display updating and capacitive sensing periods withrepeatably coherent frequencies and phases. In one embodiment, thesesynchronization signals may be configured to allow the relatively stablevoltages at the beginning and end of the input sensing period tocoincide with display update periods with relatively stable voltages(e.g., near the end of a input integrator reset time and near the end ofa display charge share time). A modulation frequency of a modulated ortransmitter signal may be at a harmonic of the display line update rate,where the phase is determined to provide a nearly constant chargecoupling from the display elements to the receiver electrode, allowingthis coupling to be part of the baseline image.

The sensor module 204 includes circuitry configured to receive resultingsignals with the sensing elements 124 comprising effects correspondingto the modulated signals or the transmitter signals during periods inwhich input sensing is desired. The sensor module 204 may determine aposition of the input object 140 in the sensing region 170 or mayprovide a signal including information indicative of the resultingsignal to another module or processor, for example, a determinationmodule (not shown) or a processor of the electronic device 150 (i.e., ahost processor), for determining the position of the input object 140 inthe sensing region 170. In one embodiment, the determination module isdisposed on a first integrated circuit and the sensor module 204 isdisposed on a second integrated circuit.

The display driver module 208 may be included in or separate from theprocessing system 110. The display driver module 208 includes circuitryconfigured to provide display image update information to the display ofthe display device 160 during non-sensing (e.g., display updating)periods.

In one embodiment, the processing system 110 comprises a firstintegrated controller comprising the display driver module 208 and atleast a portion of the sensor module 204 (i.e., transmitter moduleand/or receiver module). In another embodiment, the processing system110 comprises a first integrated controller comprising the displaydriver module 208 and a second integrated controller comprising thesensor module 204. In yet another embodiment, the processing systemcomprises a first integrated controller comprising display driver module208 and a first portion of the sensor module 204 (e.g., one of atransmitter module and a receiver module) and a second integratedcontroller comprising a second portion of the sensor module 204 (e.g.,the other one of the transmitter and receiver modules). In thoseembodiments comprising multiple integrated circuits, a synchronizationmechanism may be coupled between them, configured to synchronize displayupdating periods, sensing periods, transmitter signals, display updatesignals, and the like.

As discussed above, the sensor electrodes 120 of the sensing elements124 may be formed as discrete geometric forms, polygons, bars, pads,lines or other shapes, which are ohmically isolated from one another. Invarious embodiments, ohmically isolated comprises passively isolated,where active switches may be configured to couple different sensorelectrodes to the same signal during a period of time. The sensorelectrodes 120 may be electrically coupled through circuitry to formelectrodes of having larger plan area relative to a discrete one of thesensor electrodes 120. The sensor electrodes 120 may be fabricated fromopaque or non-opaque conductive materials, or a combination of the two.In embodiments wherein the sensor electrodes 120 are utilized with adisplay device, it may be desirable to utilize non-opaque conductivematerials for the sensor electrodes 120. In embodiments wherein thesensor electrodes 120 are not utilized with a display device, it may bedesirable to utilize opaque conductive materials having lowerresistivity for the sensor electrodes 120 to improve sensor performance.Materials suitable for fabricating the sensor electrodes 120 includeindium tin oxide (ITO), aluminum, silver, copper, molybdenum, andconductive carbon materials, among others, and various sensor electrodesmay be formed of a deposited stack of different conductive materials.The sensor electrodes 120 may be formed as contiguous body of conductivematerial having little or no open area (i.e., having a planar surfaceuninterrupted by holes), or may alternatively be fabricated to form abody of material having openings formed therethrough. For example, thesensor electrodes 120 may be formed from a mesh of conductive material,such as a plurality of interconnected thin metal wires. In oneembodiment, at least one of the length and width of the sensorelectrodes 120 may be in a range of about 1 to about 2 mm. In otherembodiments, at least one of the length and width of the sensorelectrodes may be less than about 1 mm or greater than about 2 mm. Inother embodiment, the length and width may not be similar, and one ofthe length and width may be in the range of about 1 to about 2 mm.Further, in various embodiments, the sensor electrodes 120 may comprisea center-to-center pitch in the range of about 4 to about 5 mm; however,in other embodiments, the pitch may be less than about 4 mm or greaterthan about 5 mm.

The grid electrode 122 may be fabricated similar to the sensorelectrodes 120. The sensor electrodes 120 and the grid electrode 122 maybe coupled to the processing system 110 utilizing conductive routingtraces 240, 242 (shown in phantom). The routing traces 240, 242 may beformed in the same plane with at least one of the sensor electrodes 120and the grid electrode 122, or may be formed on one or more separatesubstrates and connected to the respective electrodes 120, 122 byconductive vias (not shown). Routing traces 240 and 242 may be formed ona metal layer disposed such that the sensor electrodes 120 are betweenthe metal layer and the input object. In one embodiment the metal layercomprises source driver lines and/or gate lines for a display device.The conductive traces 240, 242 and vias connected therewith may beobscured from a user by a black mask layer disposed between thecomponents and the user of the display device. At least one of therouting traces 240 and 242 may be included in the source driver metallayer. In one or more embodiments such a layer may be referred to as ametal interconnect layer two. Further, routing traces 240 and/or 242 maybe disposed on a metal layer between source driver lines. Alternately,at least one of the routing traces 240 and 242 may comprise one or moreconductors in the gate driver metal layer, or gate driver lines that arenot configured for display updating. Further, routing traces 240 and/or242 may be disposed on a metal layer between gate driver lines. Inanother embodiment, at least one of the routing traces 240 and 242 maycomprise one or more conductors in the Vcom jumper metal layer, or Vcomlines not otherwise configured for display updating. Further, routingtraces 240 and/or 242 may be disposed on a metal layer between gateelectrodes. In other embodiments, the metal layer is included inaddition to a layer comprising the source driver lines and/or gatelines. A portion of the routing traces 140, 142 may also be formedlaterally outward of the areal bounds of the sensing elements 124. Invarious embodiments, the routing traces 240 and/or 242 may be disposedin a Vcom electrode jumper layer. The Vcom electrode jumper layer may bereferred to as metal layer three or a metal interconnect layer three. Inone embodiment, conductive traces may be disposed on both a source drivelayer and a Vcom electrode jumper layer. In various embodiments, thedisplay device may comprise a “dual gate” or “half source driver”configuration, allowing routing traces 240 and/or 242 to be disposedbetween source drivers on the source driver layer. In one or moreembodiments, connections formed between the routing traces 240 and 242and the various conductors used for display updating have an orthogonaldirection to the lengths of the routing traces and/or conductors. Forexample, each may be disposed on separate layers, with vias betweenthem.

The grid electrode 122 is disposed between at least two of the sensorelectrodes 120. The grid electrode 122 may at least partiallycircumscribe the plurality of sensor electrodes 120 as a group, and mayalso, or in the alternative, completely or partially circumscribe one ormore of the sensor electrodes 120. In one embodiment, the grid electrode122 is a planar body 212 having a plurality of apertures 210, eachaperture 210 circumscribing a respective one of the sensor electrodes120. Accordingly, the grid electrode 122 separates and circumscribes atleast 3 or more of sensor electrodes 120, and in this example, separatesand circumscribes all of sensor electrodes 120. The gap 202 spaces thebody 212 from the sensor electrode 120 disposed in the aperture 210. Inone or more embodiments, the grid electrode 122 is configured tosubstantially fill the space defined by the gap 202. In one embodiment,a second grid electrode may be disposed on a substrate between gridelectrode 122 and a touch input layer. The second grid electrode may bethe same size as grid electrode 122, or larger than grid electrode 122such that it overlaps one more sensor electrodes 120 and grid electrode122, or smaller than grid electrode 122 such that it overlaps a portionof the grid electrode 122. In various embodiments, the grid electrode122 is disposed between at least two of the sensor electrodes 120 suchthat the grid electrode 122 is on a different layer (i.e., differentsubstrate, or different side of the same substrate) and overlaps aportion of at least two sensor electrodes and the gap between the sensorelectrodes. In the embodiments where the sensor electrodes 120 compriseone or more common electrodes, the sensor electrodes may comprise theentirety of the common electrode layer.

The grid electrode 122 may also be segmented. The segmentation of thegrid electrode 122 may allow segments of the grid electrode 122 be lessvisible. The segments may interconnect using traces or vias, so that theall the segments of the grid electrode 122 may be driven simultaneouslywith a common signal. Alternatively, one or more of the segments of thegrid electrode 122 may be driven independently to facilitate scanning ofthe sensor electrodes 120 when configured as receiver electrodes incertain modes of operation as discussed further below.

As shown in the enlargement of FIG. 2, the grid electrode 122 mayinclude a first segment 230, a second segment 232 and a third segment234. The first and second segments 230, 232 are offset from each otherand sandwich a column of sensor electrodes, shown as sensor electrodes120 _(3,1), 120 _(3,2). Although not shown in the enlargement, the firstsegment 230 also separates the column of sensor electrodes 120 _(3,1-Y)from sensor electrodes 120 _(2,1-Y) while the second segment 232separates the column of sensor electrodes 120 _(3,1-Y) from an adjacentcolumn of sensor electrodes 120. The third segment 234 is disposedbetween neighboring sensor electrodes 120 within one column, shown assensor electrodes 120 _(3,1), 120 _(3,2). In some embodiments, two ormore of the segments 230, 232, 234 may be independently driven, forexample as transmitter electrodes.

In one embodiment, segments of the grid electrode 122 may each entirelycircumscribe a plurality of sensor electrodes 120 in one or more rowsand/or one or more columns. For example, a first segment of gridelectrode 122 could entirely circumscribe sensor electrodes 120 _(1,1),120 _(2,1), 120 _(1,2), and 120 _(2,2). A second segment of gridelectrode 122 adjacent to the first segment could entirely circumscribeat least sensor electrodes 120 _(1,3), and 120 _(2,3) (e.g., could alsoinclude one or more sensor electrodes 120 not depicted). Similarly, athird segment of grid electrode 122 adjacent to the first segment couldentirely circumscribe at least sensor electrodes 120 _(3,1), and 120_(3,2) and could also include one or more sensor electrodes 120 notdepicted.

FIG. 3 illustrates a display panel 300 including an integrated inputdevice 100 having a pattern of capacitive sensing elements, according toone embodiment described herein. Panel 300 includes a glass layer 305which may serve as an outer layer of the panel 300. Although this layer305 is specifically disclosed as glass, layer 305 may include anysuitable transparent material—e.g., a plastic or polymer. In oneembodiment, glass layer 305 may be a protective upper layer of the panel300. Although not shown, additional layers may be added onto the glasslayer 305 when manufacturing a display device.

Layer 310 includes transparent sensor electrodes 120 which may definethe sensing region 170. Layer 310 may further include grid electrode(s)122, which are not depicted here for visual clarity. As such, thecapacitive sensing elements used to detect the proximity of an inputobject relative to the display panel 300 may be integrated within thedisplay panel instead of, for example, being laminated on top of thepanel 300—e.g., fabricated on the upper surface of glass layer 305.Layer 310 may be directly beneath the glass layer 305 or one or morelayers may separate the layers 305 and 310 within the display panel 300.

In one embodiment, layer 310 may be used when updating the display andwhen performing capacitive sensing—i.e., the sensor electrodes 120comprise common electrodes, as described above. In one embodiment, thesensor electrodes 120 include all the common electrodes in the layer310. During display updating, the sensor electrodes 120 may be coupledwith the display pixels (or, more specifically, sub-pixels of thedisplay pixels) to serve as the reference voltage (e.g., ground or Vcom)when setting the voltage across the sub-pixels. During capacitivesensing, however, the capacitive sensing signals may be driven onto thesensor electrodes 120 in order to detect input objects. In oneembodiment, layer 310 may be a Vcom layer that is patterned into thesensor electrodes 120 in order to serve the dual purposes describedabove. In other embodiments, the sensor electrodes 120 may be integratedinto other layers of the display panel 300, e.g., such as the layer thatforms the gate electrodes. Thus, in order to integrate the sensorelectrodes 120 into a display panel 300, additional thickness is notadded to the panel 300 relative to a display panel that does not containcapacitive sensing elements.

Display panel 300 includes a source line layer 315 which routes thevarious source lines 330 for driving voltages onto the display pixels ofthe panel 300. As shown, layer 315 also includes routing traces 240,242, which may be interleaved or otherwise suitably arranged relative tothe source lines 330. Although not shown, display panel 300 may includea number of conductive vias that couple the routing traces 240, 242 onlayer 315 to one or more of the sensor electrodes 120 (and/or gridelectrode(s) 122) of layer 310. Although FIG. 3 depicts source linelayer 315 as directly contacting layer 310, this is not a requirement.For example, the vias may extend through multiple layers in order toelectrically connect the routing traces 240, 242 with the sensorelectrodes 120.

In some embodiments, layers 310 and 330 are included in an assembly 340.The assembly 340 further includes the plurality of conductive vias (notshown) coupling the sensor electrodes 120 (and/or grid electrode(s) 122)of layer 310 with the routing traces 240, 242 on the source line layer315. The assembly 340 may correspond to an intermediate stage of themanufacturing process of display panel 300 and/or to a portion of thedisplay panel 300 when manufactured. The assembly 340 is configured tocouple with a processing system through routing traces 240, 242 tooperate the sensor electrodes 120 and/or grid electrode(s) 122. Theassembly 340 may therefore be operable using a number of differentprocessing systems. In some embodiments, the assembly 340 may includeone or more additional layers, may have a different ordering of thelayers, and so forth.

Display material layer 320 may include display pixels. That is, thematerial used to form the display pixels (e.g., liquid crystal, emissiveelectroluminescent material, etc.) may be placed on layer 320. As such,the panel 300 may include vias that couple the pixels in layer 320 withthe source lines 330 in layer 315.

Display panel 300 may include a gate line layer 325 which includes aplurality of gate lines 335 operable to electrically couple the sourcelines 330 with the pixels in the display material layer 320. As such,panel 300 may include vias that couple the gate lines 335 to switchingelements (not shown) in the display material layer 320. Moreover, thelayers depicted in FIG. 3, as well as their relative ordering, are forillustration purposes only, and are not intended to limit the differentdisplay panels which may be used consistent with the embodimentspresented herein. For example, the display panel 300 may include more orless layers than the layers shown, the display panel 300 may order thelayers differently, etc.

FIG. 4 illustrates an exemplary arrangement of vias in a regularpattern, according to one embodiment. The vias 415 are used toelectrically couple different layers of an assembly 340, which asdiscussed above may be included as part of a display panel and/or aninput device. More specifically, FIG. 4 shows a transparent, top-downschematic view of an arrangement 400 of the assembly 340 coupled with aprocessing system 110.

In arrangement 400, the sensor electrodes 120 (120 _(1,1) to 120 _(3,4))are arranged in a matrix having three (3) columns and four (4) rows.Each column of sensor electrodes 120 corresponds to a number of routingtraces 240 and a number of source lines 330. As shown, each column ofsensor electrodes 120 (e.g., Columns 1, 2, 3) corresponds to aparticular display column 405 ₁, 405 ₂, 405 ₃ having eight (8) sourcelines 330. Each column of sensor electrodes 120 also corresponds to aparticular sensing column 410 ₁, 410 ₂, 410 ₃ (individually orcollectively, columns 410) having up to eight (8) routing traces 240.The numbers of source lines 330 and routing traces 240 may vary, and mayalso vary from each other. The sensing region 170 is defined proximateto the plurality of sensor electrodes 120. The source lines 330 androuting traces 240 are disposed in an alternating pattern and inparallel with each other, which can provide improved consistency of thesensing within the sensing region 170, but this is not a requirement.Additionally, in this arrangement 400, the source lines 330 and routingtraces 240 do not need to cross to couple with the processing system110, so that both may be disposed within the same layer withoutrequiring any further processing.

Vias 415 connect the sensor electrodes 120 disposed on a first layerwith the routing traces 240 disposed on a second layer. In variousembodiments described herein, the vias 415 are arranged in regularpattern within an areal extent of the sensing region 170. As discussedherein, a regular pattern includes a plurality of vias disposed with asame pitch along one or more dimensions (i.e., providing equal spacingfor neighboring via locations). Some examples of via pitch include pitchrelative to a horizontal dimension (e.g., Pitch_(H)), pitch relative toa vertical dimension (e.g., Pitch_(V)), and pitch relative to one ormore off-axis dimensions (e.g., Pitch_(OFF)). Off-axis dimensions may bedefined relative to any desired orientation from a reference dimension,such as “horizontal,” “vertical,” or any alternative predefined axis.For example, PitchOFF could correspond to a certain angle, such as 35°above horizontal.

In one embodiment, the regular pattern of vias 415 corresponds to a samepitch along a single dimension. In other embodiments, the regularpattern includes vias having a same pitch along two or more dimensions.For example, the pattern of vias 415 in arrangement 400 has a samerespective pitch in each of the horizontal, vertical, and off-axisdimensions. While it is possible that Pitch_(H) equals Pitch_(V) equalsPitch_(OFF), this is not a requirement.

The regular pattern of vias 415 in some cases may correspond to thearrangement of the sensor electrodes 120 connected with the vias. Forexample, the sensor electrodes 120 included in a particular row (e.g.,sensor electrodes 120 _(1,1), 120 _(2,1), 120 _(3,1) of Row 1) each havea corresponding via 415 that is disposed in a same location relative tothe respective sensor electrode 120. Although a single via 415 isdisplayed per sensor electrode 120, embodiments may include sensorelectrodes 120 that are each connected with multiple vias, so long asthe resulting via pattern is regular. While the array of sensorelectrodes 120 depicted in arrangement 400 represents a rectangular(Cartesian) arrangement of rows and columns, the regular pattern of vias415 may be implemented using different arrangements of the sensorelectrodes 120. The sensor electrodes 120 may have alternative shape(s)(such as hexagonal, or any other suitable regular or non-regular shape),and the sensor electrodes 120 may be arranged based on the alternateshape(s) (e.g., a hexagonal array).

While the regular pattern of vias 415 in arrangement 400 are depicted asbeing regularly spaced throughout the areal extent of sensing region170, in other embodiments the regular patterns may include groups ofvias 415 having a regular spacing within the groups (say, one or moreintra-group pitch values) and having a regular spacing between thegroups (say, one or more inter-group pitch values).

A regular pattern of vias 415 provides a number of benefits during themanufacturing of the assembly and/or the operation of the manufacturedassembly. In some cases, the regular pattern of vias permits a simplerprocess of visual inspection of the assembly during production, as acamera or other visual sensing device may have a reduced number ofchanges to orientation, position, etc. to detect all of the vias 415 ofassembly 340. In some cases, the regular pattern of vias 415 increasesthe uniformity of the assembly, which can increase the reliability ofits operation. In some cases the regular pattern of vias 415 can reducethe number of lines or traces formed or otherwise included in theassembly 340. In these cases, the lines or traces can be cut orotherwise segmented to provide desired via connections with the sensorelectrodes 120. Such a feature permits the assembly 340 to be customizedfor use with a particular processing system. For example, multiplexingcapabilities of different processing systems may vary, so that thetraces of the assembly 340 may be cut differently in order to connectwith the target processing system. The desired connections of theprocessing system 110 with sensor electrodes 120 may be formed bycutting or segmenting the lines.

Each source line 330 is connected with the processing system 110 at acorresponding pad 425. Similarly, each of the routing traces 240 isconnected with the processing system 110 at a corresponding pad 430.Each pad 425, 430 generally represents a conductive connection with adistinct pin or terminal of the sensor module 204 or display drivermodule 208. The pads 425, 430 may be arranged in a plurality of groups435A-435I (collectively or individually, groups 435). The processingsystem 110 may operate the sensor electrodes 120 according to the groups435. For example, the sensor module 204 of the processing systemincludes a limited number of analog to digital converters (ADCs) formeasuring the input provided at the sensor electrodes 120. To save spaceand/or decrease the power consumption of the processing system 110, thesensor module 204 may include fewer ADCs than the number of pads 430,and may further include logic (such as multiplexer circuitry) to connectselected ones of the pads 430 with a corresponding ADC for sampling. Asshown, each group 435A-435I corresponds to three (3) different pads 430.In some embodiments, the groups 435 may allow the processing system 110to sense with a desired sensing shape (such as contemporaneous sensingon a plurality of adjacent rows), which can help detect and filter noiseduring sensing.

The pads 425, 430 are arranged in the processing system 110 such thatthe routing traces 240 and source lines 330 are substantially parallelwith each other. As shown, the pads 425 are disposed in a first row andparallel to a second row of the pads 430, with the pads 425, 430interleaved (or alternating) along the length of the rows. Moreover, therouting traces 240 and sources lines 330 need not cross over each otherin this example. As will be seen in further examples, however, anddepending on the composition and layout of the groups 435, it may bechallenging to acquire a desired sampling shape. For example, it can bebeneficial to couple those routing traces 240 corresponding to eachsensing column 410 in a consistent pattern with the groups 435, but thegroups 435 may not be completely aligned with the columns 410. As shown,a left-most routing trace 240 of sensing column 405 ₁ (and connected toa via 415 in Row 1) is connected with a left-most pad 430 of group 435A,but the left-most routing trace 240 of column 405 ₂ (also connected atRow 1) is connected with a right-most pad 430 of group 435C, and theleft-most routing trace 240 of column 405 ₃ (also connected at Row 1) isconnected with a middle pad 430 of group 435F. These routing traces 240,though connected with the same row of sensor electrodes 120, are notsimilarly aligned relative to the respective groups 435. In some cases,the processing system 110 may be unable to sense with a desired shape(say, all sensor electrodes 120 of Row 1 sampled contemporaneously)because of the different alignment.

In some embodiments, the assembly 340 includes one or more dummy traces420. The dummy traces 420 may be disposed in the same layer as therouting traces 240 and/or the source lines 330. The dummy traces 420 aredisposed substantially parallel to the routing traces 240 and/or thesource lines 330. Though not shown here, the dummy traces 420 may alsobe connected with one or more dummy vias that are included in theregular pattern of vias. The dummy traces 420 may be formed similarly tothe routing traces 240, or may be formed differently. In someembodiments, the dummy traces 420 have the same physical properties(materials, dimensions) as routing traces 240 but are cut, segmented, orotherwise not connected with the processing system 110. In some cases,the dimensions of the segments or locations of the cuts of the dummytraces 420 can be selected to improve signal settling time on therouting traces 240. For example, the dummy traces 420 may be segmentedto reduce a resistance of the dummy traces 420, and/or to reduce acapacitance of the dummy traces 420 with the routing traces 240.

As shown, four segments of a particular dummy trace (420A-420D) areshown, with each segment overlapping with a single sensor electrode 120.In other embodiments, the dummy traces 420 may extend across multiplesensor electrodes 120. In some embodiments, a dummy trace 420 having oneor more segments may be disposed inline with a routing trace 240. In oneembodiment, a segment of an inline dummy trace 420 may overlap with thesame sensor electrode 120 as the corresponding routing trace 240, suchas within an area 422. In one embodiment, an inline dummy trace 420 isdisposed over different sensor electrode(s) 120 than the correspondingrouting trace 240.

FIG. 5 illustrates interleaved groups of pads within an exemplaryprocessing system, according to one embodiment. Specifically, processingsystem 500 represents one possible implementation of the processingsystem 110. The processing system 500 includes a plurality of pads 430-1to 430-48 (collectively or generically, pad(s) 430) that are configuredto connect with corresponding routing traces 240 (not shown). Each ofthe pads 430 is coupled with sensor module 504, which represents onepossible implementation of the sensor module 204 discussed above. Withinthe sensor module 504, each pad 430 is connected with a switching devicethat operates to selectively couple the pad 430 with a common (VCOM)electrode 510 in a first state 505, and with a respective analogfront-end (AFE) 520-1 to 520-5 of the processing system 500 in a secondstate 515. The AFEs 520-1 to 520-5 generally include signal conditioningcircuitry, analog-to-digital converter circuitry, sampling circuitry,etc. used for making sensing measurements to determine the presenceand/or location of input objects. Each of the AFEs 520-1 to 520-5 isconfigured to connect with a plurality of the pads 430 according to aninterleaved group 435 ₁, 435 ₂, etc. For example, group 435 ₁corresponds to pads 430-1, 430-6, 430-11 (not shown), . . . , and430-46. Group 435 ₂ corresponds to pads 430-2, 430-7, 430-12 (notshown), . . . , and 430-47. The AFEs 520-1 to 520-5 each includeconductive connections with the switching devices for the pads 430 ofthe corresponding group 435.

During operation of the processing system 500, a number of consecutivepads 430 may be sampled contemporaneously (that is, pads 430 connectedwith AFEs 520-1 to 520-5 to receive data from corresponding sensorelectrodes). As will be seen in FIG. 6, the consecutive pads 430 cancorrespond to consecutive rows of sensor electrodes 120 (not shown). Thenumber of pads 430 that can be sampled contemporaneously may be limitedby the number of AFEs included in the processing system 500 (here, up tofive pads 430 can be sampled contemporaneously).

In some embodiments, processing system 500 may sample each of the pads430 in a scan pattern. For example, at a first time, pads 430-1 to 430-5are coupled with respective AFEs 520-1 to 520-5 (that is, theircorresponding switching devices are in the second state 515), while theremaining pads 430-6 to 430-48 are connected with the common electrode510 (having switching devices in the first state 505). The sensorelectrodes connected with pads 430-1 to 430-5 may be sampled. At asecond time, the switch for pad 430-1 transitions into the first state505, and the switch for pad 430-6 transitions into the second state 510.The sensor electrodes connected with pads 430-2 to 430-6 may be sampled.At another time, and as illustrated in FIG. 5, pads 430-1 to 430-3 arecoupled with the common electrode 510, while pads 430-4 to 430-8 arecoupled with the AFEs 520-1 to 520-5. The scan may continue in thisincremental fashion until all of the pads 430 have been sampled at leastonce.

In other embodiments, the sampling pattern can differ from the“left-to-right” scan pattern described. In some cases, the samplingpattern could occur in the reverse direction. In some cases, thesampling pattern samples on varying numbers of consecutive pads 430.Using an example of a left-to-right pattern, the last few sample timesmight include pads 430-44 to 430-48 (five pads), then 430-45 to 430-48(four pads), 430-46 to 430-48 (three pads), and so forth. In some cases,the sampling pattern samples consecutive pads 430 in a differentsequence (e.g., pads 430-1 to 430-5 at one sampling time, 430-6 to430-10 at the next sampling time, etc.). In some cases, the samplingpattern of consecutive pads may have a non-regular sequence.

FIG. 6 illustrates an exemplary arrangement of vias in a regular patternaccording to the interleaved groups of pads illustrated in FIG. 5,according to one embodiment. FIG. 6 shows a top-down schematic view ofan arrangement 600 coupled with a processing system 500. For simplicityand clarity, the source lines 330 with corresponding pads 425 are notillustrated. As shown, the vias 415 may be arranged in a relativelysimple diagonal pattern within each column (columns 1, 2) while stillallowing several rows of sensor electrodes 120 to be sampledcontemporaneously. Using the example of sensor module 504, whichincludes five AFEs, the processing system 500 can sample on as many asfive consecutive rows of sensor electrodes 120.

Arrangement 600 also includes a plurality of vias 605 for connectingrouting traces 242 with grid electrodes 122 ₁-122 ₅. In someembodiments, the vias 415 are arranged in one regular pattern, while thevias 605 are arranged in another regular pattern. For example, and asshown, the vias 605 connected with grid electrodes 122 ₁-122 ₃ aredisposed in a diagonal pattern between the sensor electrodes 120 ofColumn 1 and Column 2. The vias 605 connected with grid electrodes 122₄, 122 ₅, and 122 ₆ (not shown) are disposed in a similar diagonalpattern between sensor electrodes 120 of Column 2 and the next adjacentcolumn. The pattern of vias 605—here, three vias 605 connected tocorresponding grid electrodes 122 between each column of sensorelectrodes—may continue across all 45 rows of sensor electrodes 120. Thepattern of vias 605 may repeat after reaching the last row and/or gridelectrode. For example, continuing the depicted pattern, vias 605 couldconnect to grid electrodes 122 ₄₃, 122 ₄₄, and 122 ₄₅ between columns 15and 16 of sensor electrodes 120. Then, the pattern of vias 605 mayrepeat, with the vias 605 disposed between columns 16 and 17 connectingto grid electrodes 122 ₁-122 ₃ similar to the vias 605 depicted betweencolumns 1 and 2, and so forth. Other regular patterns for vias 605 arepossible. Thus, the vias 415 of arrangement 600 form a first patternthat is essentially repeated within each column of sensor electrodes120, while the vias 605 form a second pattern different from the firstpattern and that repeats after several columns of sensor electrodes 120.In another embodiment, however, the vias 415, 605 can be arrangedtogether in a single regular pattern.

The arrangement 600 benefits from the use of interleaved groups of pads430. With the interleaved groups, the pattern of vias 415 may berepeated within each column of sensor electrodes 120. Repeating the samepattern on each column reduces the complexity of visual inspection ofthe vias 415, and may further enhance regularity of the processingsystem 500 during operation. In some cases, interleaved groups can beused to reduce a number of dummy vias and dummy traces used in aparticular implementation. In some cases, the interleaved groups supportan implementation where no dummy vias and dummy traces are included atall.

FIGS. 7 and 8 each illustrate an exemplary arrangement of vias in aregular pattern and supporting sensing on multiple adjacent rows ofsensor electrodes, according to one embodiment. As discussed above,contemporaneous sensing with adjacent rows may be a desired sensingpattern for detecting and filtering noise during sensing.

FIG. 7 shows a top-down schematic view of an arrangement 700 coupledwith a processing system 110. For simplicity and clarity, the sourcelines 330 and corresponding pads 425 are not illustrated. Thearrangement 700 includes a plurality of rows, each row corresponding toone or more sensor electrodes 120. For example, the arrangement 700corresponds to forty-five (45) different rows of sensor electrodes 120and nine (9) groups 435, though other numbers of rows and groups arepossible. The processing system 110 includes larger groups 435 ₁, 435 ₂,. . . , 435 _(n) that each correspond to eight (8) pads 430. Here, eachgroup 435 of pads 430 corresponds to a sensing column 410 ₁, 410 ₂comprising one or more routing traces 240 and one or more dummy traces420. In some embodiments, the sensing columns 410 ₁, 410 ₂ eachcorrespond to a column of sensor electrodes 120. In some cases, thesensing columns 410 ₁, 410 ₂ may further correspond to one or more gridelectrodes. The dummy traces 420 may be continuous or segmented, asdescribed above. Vias 415 connect sensor electrodes of certain rows withthe processing system 110.

As illustrated in FIG. 7, the pattern of vias 415 within arrangement 700may be regular while supporting contemporaneous sensing on multiplerows. For example, if each of groups 435 ₁₋₉ are connected with arespective ADC—say, the routing traces 240 of each group 435 areconnected to the respective ADC through corresponding multiplexingcircuitry—the processing system 110 at a first time maycontemporaneously acquire sensing information on Row 1 using group 435₁, on Row 2 using group 435 ₂, and so forth, to Row 9 using group 435 ₉.The processing system 110 may similarly acquire sensing information onRows 10-18 at a second time, Rows 19-27 at a third time, Rows 28-36 at afourth time, and Rows 37-45 at a fifth time. The first through fifthtimes may occur in any desired order, whether sequentially or not.Further, although the arrangement 700 supports sampling on up to ninerows simultaneously, the processing system 110 may sample on fewer thanall nine rows in some cases.

FIG. 8 shows a top-down schematic view of an arrangement 800 coupledwith a processing system 110. The arrangement 800 generally isstructured similarly to arrangement 400, except that certain of therouting traces 240 are routed across certain source lines 330.

In arrangement 800, the routing traces 240 of one or more sensingcolumns 410 (e.g., 410 ₁) may align with the pads 430 of processingsystem 110 such that the routing traces 240 do not need to be routedacross the source lines 330 of the corresponding display column (e.g.,405 ₁). For example, the routing traces 240 of the sensing columns 410may have a preferred alignment relative to the groups 435 (e.g., alignedsuch that a left-most routing trace 240 corresponds to a left-most pad430 of a group 435). In another example, there might not be a preferredalignment for connection with the processing system 110, but one sensingcolumn 410 is designated as a reference for the other sensing columns410. In other words, the routing traces 240 of the other sensing columns410 are connected with the processing system 110 based on the relativealignment of the reference sensing column 410 with groups 435.

In order to provide a desired alignment of one or more other sensingcolumns 410 (e.g., 410 ₂, 410 ₃) relative to the groups 435 ofprocessing system 110, the corresponding routing traces 240 of the othersensing columns 410 may cross source lines 330 of the correspondingdisplay column (e.g., 405 ₂, 405 ₃) within overlap areas 805A, 805B. Forexample, the left-most routing trace 240 of sensing column 410 ₂ crossesa source line 330 at overlap area 805A to connect with a left-most pad430 of group 435D. Likewise, the left-most routing trace 240 of sensingcolumn 410 ₃ crosses a source line 330 at overlap area 805B to connectwith a left-most pad 430 of group 435F.

In one embodiment, the routing traces 240 are disposed on a differentlayer than the source lines 330 and separated by insulative material orair, so that the routing traces 240 and source lines 330 are not shortedtogether at the overlap areas 805A, 805B. In another embodiment, therouting traces 240 and source lines 330 may be included on the samelayer and are shorted together at the overlap areas 805A. In such anembodiment, the processing system 110 may operate the sensor electrodes120 and drive the source lines 330 in a manner suitable to perform thedisplay updating and sensing functionalities. For example, theprocessing system 110 might perform display updating and sensing duringnon-overlapping time periods or using signals at sufficientlydistinguishable frequencies. The processing system 110 may alsocompensate for the effects of display updating on sensing, and viceversa. For example, the processing system 110 could periodically driveor short source lines 330 or routing traces 240 to a reference or otherpredetermined voltage to mitigate charge coupling caused by displayupdating or sensing, could perform calculations on the sensing input toremove the electrical effects caused by display updating, and so forth.

FIG. 9 illustrates an exemplary arrangement of vias in a regular patternand supporting sensing with one or more grid electrodes, according toone embodiment. The arrangement 900 includes segmented grid electrodes122 ₁-122 ₄ (individually or collectively, grid electrodes 122), eachcorresponding to a particular row of sensor electrodes 120 and at leastpartly circumscribing those sensor electrodes 120. For example, gridelectrode 122 ₁ at least partly circumscribes the sensor electrodes 120_(1,1), 120 _(2,1), and 120 _(3,1) of Row 1. Although the gridelectrodes 122 are shown as partially circumscribing sensor electrodesof a particular row across multiple columns, in some embodiments aparticular grid electrode 122 may partly or wholly circumscribe sensorelectrodes 120 of two or more different rows and one or more columns.

As discussed above, the grid electrodes 122 can be operated by theprocessing system 110 as part of performing sensing. Accordingly, gridelectrodes 122 are coupled with the processing system 110 at severalpads 430. The grid electrodes 122 connect with the processing system 110using routing traces 242 coupled with vias 605. The routing traces 242may generally have similar properties as the routing traces 240 used toconnect the sensor electrodes 120 with the processing system 110, andthe vias 605 may generally have similar properties as vias 415. In somecases, routing traces 242 may cross over one or more source lines 330 toconnect with a particular pad 430 of the processing system 110. Forexample, the routing trace 242 included in sensing column 410 ₃ crossesthree (3) source lines 330 to connect with a center pad 430 of group435G, which has an adjacent position to the last connection of therouting traces 240 of the sensing column 410 ₃. However, as seen insensing column 410 ₂, the routing trace 242 of a particular sensingcolumn 410 might not cross source lines 330 even though other routingtraces 240 cross source lines 330 to align with groups 435D, 435E.

In some embodiments, the vias 605 are included with vias 415 in theplurality of vias forming a regular pattern within the areal extent ofthe sensing region. In order to maintain the regular pattern, theplurality of vias may also include one or more dummy vias 910 thatconnect with the grid electrodes 122 but not with the processing system110. In some embodiments, the dummy vias 910 are further coupled withdummy traces 915 disposed in parallel with the source lines 330 androuting traces 240. The dummy traces 910 may have similarcharacteristics as the dummy traces 420 described above. Connecting thedummy traces 910 to the grid electrodes 122 may be beneficial forsensing performance, as the dummy traces 910 are held at the samepotential as the grid electrodes 122, and are not floating. While notshown, arrangement 900 may also include (segments of) dummy traces 420,such as inline with one or more of the routing traces 240. Although notdepicted, in some embodiments a plurality of routing traces 240, 242 maybe coupled with a respective sensor electrode 120 or a grid electrode122. The number of multiple routing traces 240, 242 may be selectedbased on a desired signal settling speed (that is, based on resistanceand capacitance values) for the sensor electrode 120 or grid electrode122.

FIG. 10 illustrates an implementation of a processing system includingmultiple portions of a display driver module, according to oneembodiment. Arrangement 1000 may generally be used with the assembly340, and provides an implementation in which the processing system 110includes multiple portions of display driver module 208. The portions208-1, 208-2 may be distinct ICs, and the processing system 110 mayinclude the sensing module 204 disposed between the two portions 208-1,208-2. In alternative embodiments, processing system 110 may includemore than two portions of the display driver module 208 and/or two ormore portions of the sensing module 204, which may be disposed in anysuitable arrangement.

Arrangement 1000 includes twenty-four (24) routing traces 240 andtwenty-four (24) source lines 330, although other numbers of each arepossible. For example, the arrangement 1000 may alternatively include anumber of dummy traces, one or more grid electrodes, and so forth. Eachdisplay column 405 corresponds to eight (8) source lines 330, and eachsensing column 410 corresponds to eight (8) routing traces 240. Thearrangement 1000 further includes a regular pattern of vias 415connected with routing traces 240, similar to that depicted in FIGS. 4and 6. Portion 208-1 includes twelve (12) pads, eight of which connectto routing traces 240 of display column 405 ₁ and four of which connectto routing traces 240 of display column portion 405 _(2A). Portion 208-2also includes twelve (12) pads, eight of which connect to routing traces240 of display column 405 ₃ and four of which connect to routing traces240 of display column portion 405 _(2B). Thus, the display column 405 ₂is controlled partially by portion 208-1 and partially by portion 208-2.The processing system 110 may include circuitry for synchronizing timingof the portions 208-1, 208-2, as well as with the sensing module 204.

Sensing module 204 includes twenty-four (24) pads, and couples withrouting traces 240 of sensing columns 410 ₁-410 ₃. In this embodiment, arelatively larger number of routing traces 240 may overlap with sourcelines 330. Accordingly, arrangement 1000 may provide spatial separationbetween routing traces 240 and source lines 330, and/or processingsystem 110 may provide time and/or frequency separation throughgenerated signals, as discussed above. Additionally, processing system110 may perform operations to mitigate or compensate for the effects ofdisplay updating on sensing, and vice versa.

FIG. 11 illustrates techniques for selectively connecting a plurality ofrouting traces with an arrangement of vias in a regular pattern,according to one embodiment. Arrangement 1100 generally provides anenlarged view of a portion of display panel 300 (FIG. 3), consistentwith any of the embodiments described herein.

Arrangement 1100 includes two adjacent pixels 1105A, 1105B. Each pixel1105A, 1105B includes a respective red sub-pixel 1106A, 1106B, arespective green sub-pixel 1107A, 1107B, and a respective blue sub-pixel1108A, 1108B. Any other suitable pixel geometries for a display are alsopossible, such as red/green/blue/yellow, red/green/blue/white,red/green/blue/yellow/cyan, and so forth. The pixels 1105A, 1105B may beincluded in a display material layer 320 (FIG. 3) separate from thelayers of the assembly 340. The source lines and gate lines used tooperate the pixels 1105A, 1105B are not depicted.

A number of vias 1110 are included in the arrangement 1100 and arearranged in a regular pattern. The vias 1110 are used to selectivelycouple sensor electrodes 120 (not shown) with routing traces 240, 242.As shown, each via 1110 overlaps a corresponding sub-pixel; the vias1110 correspond to the sub-pixels in a 1:1 ratio. The vias 1110 may beincluded in any of the vias (e.g., 415, 605) or dummy vias (e.g., 910)described herein. For example, vias 1110 correspond to vias 415, 605, or910 in a 1:1 ratio. In another example, more than one via 1110corresponds to a single via 415, 605, or 910.

In alternative embodiments, the positioning of vias 1110 relative tosub-pixels, the ratio of vias 1110 to sub-pixels, etc. may vary so longas the overall pattern of vias remains regular. For example, the vias1110 may be arranged to not overlap a sub-pixel, to overlap more thanone sub-pixel, and so forth. Each via 1110 is coupled with a conductiveconnection 1115 that is selectively connected with the routing traces240, 242.

In some embodiments, the connection 1115 may be severed along a verticalcut line 1120, such that a via 1110 is not coupled with thecorresponding routing trace 240, 242. In these cases, the connection1115 might be formed in the metal to already include the discontinuity,the discontinuity might be added later (e.g., by cutting or etching), orthe connection 1115 might not be formed at all. In one example, say aparticular routing trace 242 connects with a grid electrode 122 disposedoutside the view of arrangement 1100. If the illustrated vias 1110connect with a sensor electrode 120, the vias 1110 that are disposedalong the particular routing trace 242 may be disconnected from therouting trace 242 so that the grid electrode does not short with thesensor electrode.

Additionally, the routing traces 240, 242 may be severed along ahorizontal cut line 1125 to selectively connect sensor electrodes and/orgrid electrodes and/or an associated processing system. Alternative cutpatterns or locations of discontinuities are also possible.

FIG. 12 is a functional diagram of an exemplary arrangement of vias in aregular pattern relative to an array of sensor elements including gridelectrodes, according to one embodiment. Arrangement 1200 displays aplurality of sensor electrodes 120 ₁-120 ₄ that are partiallycircumscribed by grid electrodes 122 ₁, 122 ₂. A plurality of routingtraces 240 ₁-240 ₄ connect with the sensor electrodes 120 ₁-120 ₄ atrespective vias 415A-415D. A plurality of routing traces 242 ₁, 242 ₂connect with the grid electrodes 122 ₁, 122 ₂ at respective vias 605.Arrangement 1200 also includes a plurality of dummy electrodes 420,915A-915D connected with respective dummy vias 1205, 910A-910D.

FIG. 13 illustrates an exemplary configuration of a plurality of routingtraces to implement the arrangement of vias depicted in FIG. 12,according to one embodiment. More specifically, arrangement 1300 showsthe functional diagram of FIG. 12 relative to a number of sub-pixels1305 (which may represent any of the sub-pixels 1106, 1107, 1108discussed above). The arrangement 1300 may provide a regular pattern ofa plurality of vias at one or more levels, each of which can simplifythe inspection process as well as improving performance consistency ofthe completed product. For instance, at a first level, the arrangement1300 provides a regular pattern of the vias 1110 corresponding to eachsub-pixel 1305. At another level, the arrangement 1300 provides aregular pattern of the vias 415A-415D and vias 605 (each of which mayinclude one or more of the vias 1110) used to connect with varioussensor electrodes and grid electrodes. At yet another level, thearrangement 1300 can provide a regular pattern of dummy vias (e.g.,including dummy vias 910A-910D, 1205).

Thus, the embodiments and examples set forth herein were presented inorder to best explain the embodiments in accordance with the presenttechnology and its particular application and to thereby enable thoseskilled in the art to make and use the present technology. However,those skilled in the art will recognize that the foregoing descriptionand examples have been presented for the purposes of illustration andexample only. The description as set forth is not intended to beexhaustive or to limit the disclosure to the precise form disclosed.

In view of the foregoing, the scope of the present disclosure isdetermined by the claims that follow.

We claim:
 1. An input device comprising: a plurality of sensorelectrodes, wherein each sensor electrode of the plurality of sensorelectrodes comprises at least one common electrode of a plurality ofcommon electrodes of a display device, the common electrodes configuredto be driven for display updating and capacitive sensing; a plurality ofsource lines; and a processing system comprising: a display drivermodule comprising a first plurality of display driver pads and a secondplurality of display driver pads, wherein each of the first and secondplurality of display driver pads are coupled to at least one source lineof the plurality of source lines, the display driver module configuredto drive the plurality of source lines for display updating; and asensor module comprising a plurality of sensor pads coupled to theplurality of sensor electrodes, the sensor module configured to drivethe plurality of sensor electrodes for capacitive sensing, wherein theplurality of sensor pads is disposed between the first plurality of padsand the second plurality of pads.
 2. The input device of claim 1 furthercomprising an integrated circuit and wherein the display driver moduleand the sensor module are disposed on the integrated circuit.
 3. Theinput device of claim 1 further comprising a first integrated circuitand a second integrated circuit, wherein the first plurality of displaypads are disposed on the first integrated circuit and the sensor moduleis disposed on the second integrated circuit.
 4. The input device ofclaim 1, wherein the plurality of sensor pads is coupled to theplurality of sensor electrodes through a plurality of conductive routingtraces and wherein a first conductive routing trace of the plurality ofrouting traces and a first source line of the plurality of source linesoverlap each other.
 5. The input device of claim 1, wherein the sensormodule further comprises a switching device configured to selectivelycouple each sensor pad of the plurality sensor pads with a respectiveone of a plurality of analog front-ends and with a common electrode. 6.The input device of claim 5, wherein during a first period the switchingdevice is configured to couple a first sensor pad of the plurality ofsensor pads with a first analog front-end of the plurality of analogfront-ends, and to couple a second sensor pad of the plurality of sensorpads with the common electrode.
 7. The input device of claim 6, whereinduring a second period the switching device is configured to couple thefirst sensor pad with the common electrode, and to couple the secondsensor pad with the first analog front-end.
 8. A processing systemcomprising: a display driver module comprising a first plurality ofdisplay driver pads and a second plurality of display driver pads,wherein each of the first and second plurality of display driver padsare coupled to at least one source line of a plurality source lines, thedisplay driver module configured to drive the plurality of source linesfor display updating; and a sensor module comprising a plurality ofsensor pads coupled to a plurality of sensor electrodes, wherein eachsensor electrode of the plurality of sensor electrodes comprises atleast one common electrode of a plurality of common electrodes of adisplay device, the common electrodes configured to be driven fordisplay updating and capacitive sensing, the sensor module configured todrive the plurality of sensor electrodes for capacitive sensing, whereinthe plurality of sensor pads is disposed between the first plurality ofpads and the second plurality of pads.
 9. The processing system of claim8 further comprising a determination module configured to determinepositional information based on resulting signals received by the sensormodule when the sensor module drives the plurality of sensor electrodesfor capacitive sensing.
 10. The processing system of claim 9, whereinthe determination module is disposed on a first integrated circuit andthe sensor module is disposed on a second integrated circuit.
 11. Theprocessing system of claim 8, wherein the display driver module and thesensor module are disposed on a first integrated circuit.
 12. Theprocessing system of claim 8, wherein each of the plurality of sensorpads is coupled to the plurality of sensor electrodes through aplurality of conductive routing traces and wherein a first conductiverouting trace of the plurality of routing traces and a first source lineof the plurality of source lines overlap each other.
 13. The processingsystem of claim 8, wherein the sensor module further comprises aswitching device configured to selectively couple each sensor pad of theplurality sensor pads with a respective one of a plurality of analogfront-ends and with a common electrode.
 14. The processing system ofclaim 13, wherein during a first period the switching device isconfigured to couple a first sensor pad of the plurality of sensor padswith a first analog front-end of the plurality of analog front-ends, andto couple a second sensor pad of the plurality of sensor pads with thecommon electrode.
 15. The processing system of claim 14, wherein duringa second period the switching device is configured to couple the firstsensor pad with the common electrode, and to couple the second sensorpad with the first analog front-end.
 16. The processing system of claim15, wherein during the first period and the second period, the commonelectrode is configured to be driven with a shielding signal.
 17. Theprocessing system of claim 16, wherein the shielding signal is one of avarying voltage signal and a constant voltage signal.
 18. The processingsystem of claim 14, wherein the first period corresponds to anon-display update period that occurs between two display line updateperiods of a display frame.
 19. The processing system of claim 18,wherein the non-display update period is at least as long as a displayline update period of the display frame.
 20. An input device comprising:a plurality of sensor electrodes, wherein each sensor electrode of theplurality of sensor electrodes comprises at least one common electrodeof a plurality of common electrodes of a display device, the commonelectrodes configured to be driven for display updating and capacitivesensing; a plurality of conductive routing traces, each conductiverouting trace coupled to a respective one of the plurality of sensorelectrodes; a plurality of source lines, wherein a first conductiverouting trace of the plurality of routing traces and a first source lineof the plurality of source lines overlap each other; and a processingsystem comprising: a first plurality of display driver pads; a secondplurality of display driver pads, wherein each of the first and secondplurality of display driver pads are coupled to at least one source lineof the plurality of source lines; and a plurality of sensor pads, whereeach sensor pad of the plurality of sensor pads is coupled to arespective one of the plurality of conductive routing traces, whereinthe plurality of sensor pads is disposed between the first plurality ofpads and the second plurality of pads, and wherein the processing systemis configured to drive the plurality of source lines for displayupdating, and to drive the plurality of sensor electrodes for capacitivesensing via the conductive routing traces.